Intel Announces Glass Substrates for Next-Generation Advanced Packaging

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Intel has announced that it plans to deliver its first complete glass substrate solutions later this decade. Designed to deliver even more powerful compute and advance Moore's Law with the continued scaling of transistors, Intel says that glass provides numerous benefits over existing organic solutions, such as improved rigidity, higher temperature tolerance, and far less pattern distortion, enabling more chips to fit onto a single package. As much as 50% more die content can fit on the same package size versus organic substrates, according to a 60-second primer that Intel shared.

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