Intel Claims Chipmaking Breakthrough with PowerVia

[Tsing]

Intel has announced that it's made a chipmaking breakthrough with PowerVia, a completely new way of delivering power to chip transistors by moving power routing to the backside of a wafer. Two papers about the backside power technology will be presented at the 2023 VLSI Symposium on June 11-16 in Kyoto, Japan, including a third paper that will explain Intel's research into more advanced methods to deploy PowerVia. Intel 20A and Intel 18A will be the first to introduce both PowerVia backside power technology and RibbonFET gate-all-around technology, Intel has confirmed.

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[Brian_B]

backside power technology

I tried that with the wife once and it went over ok.