Intel Teases 10x Density Improvement in Packaging and 30 to 50 Percent Logic Scaling Improvements

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Image: Intel



Intel is well on its way to propelling Moore’s Law beyond 2025.



That’s according to a new Newsroom article shared by the company, which teases some of the breakthroughs that Intel has recently made in packaging, transistors, and quantum physics. A path outlined by Intel during the IEEE International Electron Devices Meeting (IEDM) event indicates that the company is set to deliver a 10x improvement in interconnect density improvement in packaging with hybrid bonding and a 30 to 50 percent area improvement in transistor scaling, among other major breakthroughs that include some that “may one day revolutionize computing.”



Intel’s article includes two videos that provide insight on the advancements that it’s made with key technologies such as 3D Stacked Transistors and Foveros Direct, its next-gen advanced packaging:















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