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The Information has shared a paywalled report teasing the future of Apple’s silicon chips. According to its sources, Apple’s second-generation chips will leverage an enhanced version of TSMC’s 5-nanometer process and contain two dies, allowing for a boost in core count, while the third generation will leverage TSMC’s 3-nanometer process and feature four dies for up to 40 cores. Apple’s 3 nm chips are expected to debut in 2023 for Mac and iPhone devices.
From The Information, which seems confident that Intel will never be able to win Apple’s business back based on the new road map:
Last month, Intel CEO Pat Gelsinger declared that winning back Apple’s business was one of his top priorities, a move that would ease the shame of Apple having dropped Intel processors from its Mac line of computers in favor of its own designs. It looks like Gelsinger has...
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