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Image: TSMC
As if 5 nm, 4 nm, 3 nm, and 2 nm wasn’t enough, we are now hearing that TSMC plans to debut an improved version of its 3 nm manufacturing process in 2023. The news comes from DigiTimes’ sources, which claims that the first customer will be none other than Apple.
“TSMC plans to launch an enhanced version of 3nm process technology in 2023, with Apple being the initial customer adopting the process,” industry sources said.
While 3 nm+ will undoubtedly be better than the original, it isn’t clear at this point what kind of specific improvements (e.g., reduced power consumption) the plus version might entail. What we do know is that TSMC’s 3 nm process will leverage FinFET technology once again and feature an increase in density that’s equally as impressive as...
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