CEA-Leti Forms a Six Chiplet 96 Core 3D Stacked CPU That Is Called TSARLET

[Peter_Brosdahl]

Chiplet designs have really been making news in the last year or two. Most major manufacturers have either begun to release their own product lines or are at least releasing information as they research them. The folks over at TechPowerUp have taken notice of a fascinating story coming from across the pond. French research institute CEA-Leti accomplished an interesting feat. They have created a 96 core CPU using six 3D stacked chiplets. Some quick easy math shows that each chiplet has sixteen cores.



Designed to be a modular SoC, TSARLET, it is a bit of a proof of concept. Six chiplets stacked on an active interposer created this MIPS processor. The active interposer serves to provide all needed I/O between the chiplets and external connectivity. Using a multi layered mesh design for the...

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[Grimlakin]

I'm sure in this design it works fine, but in a arena needing high clocks AND multiple threads how would you dissipate the heat from a stacked chiplet design? Those chiplets in the middle are going to be flooded with heat to dissipate and heat soak will become a thing at the chiplet level.