Corsair Thinks DDR5 Memory Could Run Hotter

Peter_Brosdahl

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Corsair DIY Marketing Director George Makris and Memory Product Manager Matt Woithe recently took a trip down memory lane (cue the rimshot) to share thoughts on past and future memory designs.



Among the topics covered were concerns that DDR5 could run hotter due to design changes in the new standard. From moving voltage regulation off of the motherboard and onto the modules to incorporating a form of on-die EEC, there are a number of factors to support this idea.



They also shared that Corsair is addressing heat concerns via its patented Dual-path Heat Xchange (DHX) technology, which uses fins to cool not only the memory module but also the ground plane of the PCB itself. DXH combined with custom PCBs is expected to solve any potential heat issues with its DDR5 modules.













Corsair DIY Marketing Director, George Makris recently confirmed in a...

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Wouldn't surprise me. Each generation of RAM seems to run hotter than the last. Maybe we've finally hit the last generation that can run without at least a passive cooler. I'm actually somewhat surprised we haven't shifted to active cooling on RAM yet.
 
Wouldn't surprise me. Each generation of RAM seems to run hotter than the last. Maybe we've finally hit the last generation that can run without at least a passive cooler. I'm actually somewhat surprised we haven't shifted to active cooling on RAM yet.
Ironically I've got some G Skill memory kits that came with a mountable dual-fan adapters but I ended up taking the fans out of their adapters and using them in my current HAF case as exhaust fans right behind the 3090. Always thought they were neat but I couldn't use them as intended even if I wanted to because there was enough clearance between the HYPER212 and both sets of sticks on the x79 board.

https://www.newegg.com/g-skill-32gb-240-pin-ddr3-sdram/p/N82E16820231524
 

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