Image: Intel
Intel has become much more generous in regard to utilizing soldered metal rather than thermal paste for improving heat dissipation for its Core processors. This is evident based on a new report from MyDrivers, which delidded one of the company’s new 11th Gen Core “Rocket Lake-S” i5-11400 chips and discovered that it employed solder rather than traditional paste despite being a lower-end part. It appears that the entire Rocket Lake-S lineup of Core i9, i7, and i5 processors leverages solder—the only ones that have stuck with thermal grease are the i3, Pentium, and Celeron “Comet Lake” refreshes...
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