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During CES 2020, Intel plans to unveil a new thermal module design for notebooks involving vapor chambers and graphite.
The advanced cooling solution will reportedly allow laptops to run up to 30 percent cooler.
According to TechSpot, heat generated between the keyboard and exterior shell will be directed to the back of the screen, where it can be better dissipated.
The cooling tech is part of Project Athena, Intel's initiative for revolutionizing laptop devices.
Supply chain sources tell DigiTimes that the new thermal design utilizes a combination of vapor chambers and graphite sheets to help lower temps. Specifically, the new components will replace the traditional thermal modules that get stuffed between the keyboard and the exterior shell.
The advanced cooling solution will reportedly allow laptops to run up to 30 percent cooler.
According to TechSpot, heat generated between the keyboard and exterior shell will be directed to the back of the screen, where it can be better dissipated.
The cooling tech is part of Project Athena, Intel's initiative for revolutionizing laptop devices.
Supply chain sources tell DigiTimes that the new thermal design utilizes a combination of vapor chambers and graphite sheets to help lower temps. Specifically, the new components will replace the traditional thermal modules that get stuffed between the keyboard and the exterior shell.