SK hynix to Showcase New eSSD with 176-Layer 4D NAND, HBM3 Memory, and More at CES 2023

Tsing

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SK hynix has announced that it will be showcasing a number of its core and brand-new products at CES 2023, including the PS1010 E3.S, an eSSD (enhanced SSD) product composed of multiple 176-layer 4D NAND, and HBM3, a memory product that the company says features the world's best specification for high-performance computing.

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