TSMC Collaborates with Broadcom to Develop Worlds First 2x Reticle Sized Interposer

[Peter_Brosdahl]

Image Credit: TSMC



Taiwan Semiconductor Manufacturing Company, or TSMC, has partnered with another giant in the semiconductor sector. They and American semiconductor manufacturing company, Broadcom Inc., have created another world’s first. They’ve created the world’s first 2x reticle size interposer to enhance the CoWoS platform. CoWoS® , or Chip-on-Wafer-Substrate, is TSMC’s approach for integrating logic computing and memory into a 3-D stacked chip design. TSMC has accomplished multiple records with this design since 2012.

Image Credit: TSMC



This new interposer technology is currently stated as being the world’s largest at around 1,700mm2. It will allow for more SoCs and is compatible with...

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[Grimlakin]

Oh that's bad *** and I'm sure Intel is just over there going. We'll crap.. While amd is like.. Better yeild and performance? Sounds like a win win.