TSMC Is Working on a New Advanced Chip Packaging Technology to Increase Production Yields

[Peter_Brosdahl]

According to a report from Nikkei, which has indicated its sources are people with direct knowledge of the matter, TSMC is working on a new chip packaging design. Presently round wafer substrate designs are used for chip production but according to the report, rectangular substrates are being researched to increase chip yields.

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[Grimlakin]

TSMC a pure fab company is working on getting better yields on the chips they are contracted to produce.

Did you know that car makers want to make cars for less but charge more?

Did you know that water is wet?

It would be more interesting if they had developed a new way to stabilize the silicone substrate to reduce errors. Or had increased per wafer yields by pulling a Wendy's. Just trying I don't see as news. Every business should be trying to be better at what they do every day.

Maybe I'm just old lol.