TSMC Working with AMD and Google on SoIC, a New 3D Chip Stacking Process

[Peter_Brosdahl]

Image: TSMC



TSMC is partnering with AMD and Google in a new chip production venture. As Moore’s law loses momentum, they are (quite literally) seeking out different directions to increase performance. The latest is something we’ve seen before, but they are looking to take it to full production, and with a twist. 3-D stacking technology isn’t something necessarily new, as 3-D NAND chips have been around for a while. What makes this latest process unique is the inclusion of something AMD is known for, chiplets. TSMC’s new process is called SoIC and will incorporate horizontal 3-D stacking and linking of different chip designs...

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[hubaduba]

As I understand it, the problem with this approach is thermal management. You have layers producing heat that has to travel through other layers that are also producing heat before the heat can be removed from the package. Hopefully TSMC has found a way around this.