Future AMD Ryzen SoCs Could Utilize a New Overlapping Chip-Stacking Design, According to a Newly Discovered Patent Filing

[Peter_Brosdahl]

A new patent suggests that future AMD Ryzen SoCs will utilize a package design featuring a large die stacked on top of multiple chiplets.

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[Grimlakin]

That sounds more like a protection of an idea than an actual thing . At least so far.

 

[LazyGamer]

Looks more like a way of overcoming the limitations of their Infinity Fabric between separate dies, perhaps without going fully tiled like Intel's latest, probably to try and balance costs. Or perhaps this is just AMDs tile implementation for CPUs. Certainly not their first rodeo since they've been doing interposers with HBM for quite some time.

 

[Brian_B]

Hasn't Intel had stacking silicon for quite some time now?