New 3D X-DRAM Delivers 8x Today’s DRAM Density, 1 TB ICs by 2035

Tsing

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Neo Semiconductor has announced the launch of 3D X-DRAM, a "ground-breaking" and "game-changing" technology that represents the world’s first 3D NAND-like DRAM cell array, targeted to solve DRAM’s capacity bottleneck and replace the entire 2D DRAM market. According to a chart on the official website, 3D X-DRAM currently boasts 128 GB of estimated capacity via 230 layers, but that number is set to grow significantly in the years ahead, with 1 TB ICs hinted by 2035. What all of this seems to mean is that there will come a time when people can brag about having terabytes of RAM in their desktop PCs.

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Give it time to pan out in enterprise hardware. Seeing the memory needs of fast response AI havo of that much ram will be beneficial as long as the controllers and cpus can handle it.
 
Give it time to pan out in enterprise hardware. Seeing the memory needs of fast response AI havo of that much ram will be beneficial as long as the controllers and cpus can handle it.
Depends on the speed too - it won't do much good if it's slower than a PCI 5 SSD.
 
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