Intel Core Ultra 9 285K Can Draw Up to 370 Watts of Power, Cinebench Tests Show

Tsing

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The Core Ultra 9 285K, a new 24-core desktop processor that leads Intel's new stack of Core Ultra 200S series "Arrow Lake" CPUs, is capable of drawing a lot of power, according to several Cinebench tests that have been shared online, including one that suggests the chip can draw as much as 370 watts of power.

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This is what happens when you set the power limits to 'unlimited'... and why there are much more sane power limits by default.
 
370W is exotic cooling territory. I don't think there is a water block that can handle that kind of heat.
 
370W is exotic cooling territory. I don't think there is a water block that can handle that kind of heat.
Need a double/2.5 slot cooler. Wonder how long before we start to see GPU-style cooling on the CPU. Kinda makes me long for the old Slot 1 style CPUs
 
Need a double/2.5 slot cooler. Wonder how long before we start to see GPU-style cooling on the CPU. Kinda makes me long for the old Slot 1 style CPUs
There's a lot of surface area on a GPU water block to remove heat from. CPU waterblocks are rather small in comparison.

I could see a bigger CPU block, that also covers the VRM's as well, being an option. But since there is no layout standard they would be very expensive. Especially when each mobo manufacturers makes 50 different mobo's.
 
Not sure of the logistical engineering side of it but perhaps something like a full block with parts on top of CPU and then the back of the motherboard. I know there's a few hurdles there but it could at least keep to the standard socket designs and its well known how full block GPU designs can reign in even hotter temps.
 
There's a lot of surface area on a GPU water block to remove heat from. CPU waterblocks are rather small in comparison.

I could see a bigger CPU block, that also covers the VRM's as well, being an option. But since there is no layout standard they would be very expensive. Especially when each mobo manufacturers makes 50 different mobo's.
EK, back when they were solvent... were regularly producing various motherboard monoblocks, even selling a few MSI boards with the monoblocks already installed.

IIRC, these didn't perform any better than the average CPU block.

There's a lot of surface area on a GPU water block to remove heat from. CPU waterblocks are rather small in comparison.

It's the surface area of the CPU die itself, and even the distribution of heat on the die, that makes CPUs more difficult to cool.

What we've been seeing is wider embrace of direct-die solutions (like GPUs) that stipulate removing the CPU IHS, voiding the CPU warranty.
 
Right. Hence the Slot 1 comment.
Problem is still the 'hot spot' area and overall die area though, right? And with a slot, you push the memory and PCIe devices 'further away' electrically too, which I'd think would inhibit performance?
 
Problem is still the 'hot spot' area and overall die area though, right? And with a slot, you push the memory and PCIe devices 'further away' electrically too, which I'd think would inhibit performance?
Sockets have their use . But I wonder what the next step is for cooling.
 
Problem is still the 'hot spot' area and overall die area though, right? And with a slot, you push the memory and PCIe devices 'further away' electrically too, which I'd think would inhibit performance?
Die size is different, but not hugely different.

Ultra 9 285 is 243mm2
For comparison, nVidia 4080 is similar TDP (not exact) and die size of 379mm2

So yeah, the GPU is bigger, but not like a 4090 is bigger.

And that's before we get into the fact that not all that area is heat producing - that's just the total silicon die. But yes, larger area is generally going to mean easier to disappate the heat. That said, that's part of the reason these chips use spreaders.

Going to a slot - yeah, it makes some things more difficult. But it also allows you to mount huge slot-sized coolers like the GPUs have. That would be difficult to do if you keep the CPU horizontal and in plane with the rest of the motherboard. Not impossible, but you definitely have to move some stuff around to accommodate. But the more I think about that, even, that really only benefits air coolers that need that room for fins as close to the die as they can get, as heat pipes are only so efficient.

Move into water blocks, and that all becomes kinda moot, as water can move the heat to where ever you want pretty darned efficiently, so long as you can get the heat transfer to the water to work out. So I concede - you may have a good point about water blocks, which was your original statement.
 
370W is exotic cooling territory. I don't think there is a water block that can handle that kind of heat.
Except it isn't. Overclocked, Intel's 10980XE and its Xeon W-3475x pulled more than that. The former pulled well past 400w on its own at 4.8GHz. Granted, if you are going to pull that you are pretty much going to have to go to water cooling but you could get close with a good 360 AIO.
 
So a 420 AIO should cut it with some better fans? Seems the case..
 
So a 420 AIO should cut it with some better fans? Seems the case..
Direct die, if you're not willing to go sub-ambient (and perhaps even if you are). You can throw all the radiator you want at it, but the IHS is going to act more like an insulator and increasing radiator surface area will see increasingly minimal gains.
 
Direct die, if you're not willing to go sub-ambient (and perhaps even if you are). You can throw all the radiator you want at it, but the IHS is going to act more like an insulator and increasing radiator surface area will see increasingly minimal gains.
Seems the best move is to just not go Intel.
 
Direct die, if you're not willing to go sub-ambient (and perhaps even if you are). You can throw all the radiator you want at it, but the IHS is going to act more like an insulator and increasing radiator surface area will see increasingly minimal gains.
The problem, since the 109xx days is that the heat spreader and TIM are limiting factors in transferring heat away from the CPU die. It's not an easy problem to solve but your right. Increasing radiator capacity, airflow etc. will only net you so much in the grand scheme of things. Going sub-ambient would be the only real way to deal with that. Not that going that route doesn't create its own issues.
 
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