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Intel is continuing with performance improvements for its Arrow Lake Core Ultra 200S processors with another overclocking profile.
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Maybe one day they will compete with AMD in gaming again?Intel is continuing with performance improvements for its Arrow Lake Core Ultra 200S processors with another overclocking profile.
See full article...
And that's what it'd take (and everyone knows).
Combining it with Foveros Direct 3D hybrid bonding will allow Intel to leverage in-house technologies and compete with TSMC's SoIC approach. Direct 3D is said to achieve a bonding pitch under 5μm, which is denser than TSMC’s current 9μm SoIC-X, so this could give Intel a huge edge over AMD's current X3D CPUs. It is important to note that AMD's "3D-V Cache" implementation is one of the reasons behind the firm's success in the consumer CPU business, since users are apparently loving the extra L3 cache onboard.